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Analysis | Shallow Mainland Electric Drive System EMR4

Updated: 2022-04-01
Views: 7791

1. Forewords With the significant acceleration of electric vehicles in the market, the differences between brands, market segments and models are also increasin……

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Various losses inside the switching power supply

Updated: 2022-04-01
Views: 7893

To improve the efficiency of the switching power supply in the main loss of the switching power supply, it is necessary to distinguish and roughly estimate the various losses. The loss inside the switching power can be roughly divided into four aspects: switching loss, conducting loss, additional loss and resistance lo……

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Boost booster circuit principle and design detailed explanation

Updated: 2022-03-30
Views: 10204

The Boost circuit is a type of switch DC voltage voltage, which can make the output voltage higher than the input voltage. It is a more common circuit design in electronic circuit design. This article will introduce the basic principles and circuit parameter design to you. First of all, we need to know: capacitors hind……

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How much is the dispersing power of IGBT?

Updated: 2022-03-30
Views: 8163

Foreword 01

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Mainland electric drive system EMR4 analysis

Updated: 2022-03-17
Views: 9858

1. Forewords With the significant acceleration of electric vehicles in the market, the differences between brands, market segments and models are also increasin……

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What is the difference between the computing amplifier and the comparator

Updated: 2022-03-17
Views: 7848

The computing amplifier and the comparator are similar in appearance and schematic symbols. If the logo is polished, it is difficult to distinguish between the two. In addition, many beginners often confuse the computing amplifier with the comparator, because in some applications, the operational amplifier is used as a……

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What are the causes of MOS tube fever?

Updated: 2022-03-17
Views: 7101

It is not detailed enough, but there are generally several types of MOS tube fever: 1. The load is overweight, resulting in the flow of MOS tubes. 2. Promote insufficient incentive signals to cause MOS tube to heat up. 3. The incentive signal is too strong, which will also cause the MOS tube to heat up. Generally, the ……

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How much does SIC and silicon -based IGBT have different efficiency?

Updated: 2022-03-17
Views: 8135

Recently, the power electronics are relatively popular, and I will sort out some of the views of some materials. 2022 is a very important year used by Chinese silicon carbide. It is mainly because the 800V system has brought a lot of changes. What are the differences from all levels? I want to discuss with you based on……

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Twenty types of topology of switching power supply

Updated: 2022-03-17
Views: 8865

What is topology? The so -called circuit topology is the connection method of power devices and electromagnetic elements in the circuit, and the design of magnetic components, the design of the closed -loop compensation circuit, and the design of all circuit components depends on topology. The most basic topology inclu……

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Detailed explanation of the internal design principle and structural analysis of the chip

Updated: 2022-03-17
Views: 8583

Summary as a power R \\u0026 D engineer, of course, often contacts various chips. Some engineers may not be familiar with the interior of the chip. Many students directly enter the application page of the dataset when applying a new chip, and build an external layout based on the recommended design. That's it. In this ……

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What are the points of DC-DC's PCB design?

Updated: 2022-03-17
Views: 8363

The circuit of DC-DC is much more complicated than LDO, and the noise is greater. The layout and layout requirements are higher. The quality of Layout directly affects the performance of DC-DC, so it is crucial to understand the Layout of DC-DC. 1. Bad Layout EMI, there will be a higher DV/DT on the foot of the SW tube……

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The reliability of the electronic packaging (packaging defect, failure, etc.), this article made a clear narrative!

Updated: 2022-03-17
Views: 8767

Electronic devices are a very complicated system, and the defects and faults during the packaging process are also very complicated. Therefore, research on packaging defects and faults require a systematic understanding of the packaging process so that the cause of defects can be analyzed from multiple angles. The mech……

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