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How much does SIC and silicon -based IGBT have different efficiency?

Updated: 2022-03-17
Views: 6277

Recently, the power electronics are relatively popular, and I will sort out some of the views of some materials. 2022 is a very important year used by Chinese silicon carbide. It is mainly because the 800V system has brought a lot of changes. What are the differences from all levels? I want to discuss with you based on……

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Twenty types of topology of switching power supply

Updated: 2022-03-17
Views: 6492

What is topology? The so -called circuit topology is the connection method of power devices and electromagnetic elements in the circuit, and the design of magnetic components, the design of the closed -loop compensation circuit, and the design of all circuit components depends on topology. The most basic topology inclu……

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Detailed explanation of the internal design principle and structural analysis of the chip

Updated: 2022-03-17
Views: 6382

Summary as a power R \\u0026 D engineer, of course, often contacts various chips. Some engineers may not be familiar with the interior of the chip. Many students directly enter the application page of the dataset when applying a new chip, and build an external layout based on the recommended design. That's it. In this ……

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What are the points of DC-DC's PCB design?

Updated: 2022-03-17
Views: 6236

The circuit of DC-DC is much more complicated than LDO, and the noise is greater. The layout and layout requirements are higher. The quality of Layout directly affects the performance of DC-DC, so it is crucial to understand the Layout of DC-DC. 1. Bad Layout EMI, there will be a higher DV/DT on the foot of the SW tube……

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The reliability of the electronic packaging (packaging defect, failure, etc.), this article made a clear narrative!

Updated: 2022-03-17
Views: 6111

Electronic devices are a very complicated system, and the defects and faults during the packaging process are also very complicated. Therefore, research on packaging defects and faults require a systematic understanding of the packaging process so that the cause of defects can be analyzed from multiple angles. The mech……

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Support the manufacturing industry to realize intelligent transformation | GD32F303 universal inverter solution design

Updated: 2022-03-17
Views: 6122

In September 2020, my country clarified the goal of carbon peaks in 2030 and carbon neutrality in 2060. The realization of net zero emissions in the next forty years will be a challenging task for China. For the motor industry, the motor occupies an important position in the industrial field. According to statistics, m……

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Help sharing power replacement, smart lithium battery BMS solution based on GD32E230

Updated: 2022-03-17
Views: 6167

According to statistics, the Chinese market has 300 million two -wheeled three -wheeled electric vehicles. In 2019, my country ’s electric two -wheeled vehicles were 36.09 million vehicles and sold 34.64 million. Heavy user. With the official implementation of the new national standard on April 15, 2019, the sales volu……

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SIC MOSFET's interesting IP story set — Bingfeeling half -bag, Romm Shuanglou, residents' grounds, and ge who lying down

Updated: 2022-03-17
Views: 6433

Study notes for a silicon carbide chip amateur enthusiast. Literature sorting out, industry news, occasionally obtained, the sky is empty. This public account belongs to personal learning notes, only for personal amateur hobbies, and does not involve any business purposes. If there are irregularities in the article, pl……

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The common role of 7 MOSFET gate circuits, don't see it!

Updated: 2022-03-17
Views: 6257

It is widely used in switching power supply, motor control, electric tools and other industries. The gate is a relatively weak link in MOSFET itself. If the circuit design is improperly designed, it is easy to cause the device and even the system to fail. Therefore, this article will organize this article to organize t……

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Research progress of power electronic packaging key materials and structural design

Updated: 2022-03-17
Views: 6286

Abstract: Traditional power electronic packaging is mainly based on two -dimensional plane packaging technologies such as pheasant connection and lead bonds, which cannot meet the reliable applications of third -generation semiconductor devices in high -frequency, high -voltage, and high temperature. In order to solve ……

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What are the advantages of silicon carbide compared with silicon?

Updated: 2022-03-17
Views: 6351

Program. According to the French market research institution Yole D \\u0026 Eacute; Veloppement estimates that the SIC device market revenue will account for more than 10%of the overall power electronics market by 2025, and the revenue ratio of GAN devices will exceed 2%. Well -known suppliers of SIC components include……

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Talk about the application and development of electric vehicle IGBT technology

Updated: 2022-03-17
Views: 6307

Power devices have appeared in the mid -20th century. After nearly 30 years of development, the combination of MOS and BJT technology has spawned IGBT technology. After continuously updating, IGBT is now widely used in vehicles, welding, aerospace, and other fields. This article introduces the structure and working pri……

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