Electronics Basics

Technical Information for semiconductors and electronics.

Key points of Tesla's FSD autonomous driving solution interpretation

Updated: 2024-05-15
Views: 7579

Shortly after Musk's visit to Beijing, the China Association of Automobile Manufacturers and the National Computer Network Emergency Response Coordination Center issued a notice on the testing of four security requirements for automobile data processing. Tesla, as a foreign-funded enterprise, became one of the first ba……

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Semiconductor industry professional terms and abbreviations

Updated: 2024-04-08
Views: 6946

Semiconductor industry professional terms and abbreviations

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Basic terminology of advanced packaging

Updated: 2024-03-22
Views: 8029

Advanced packaging is a major technological highlight of the "More than Moore" era. As chip miniaturization becomes increasingly challenging and costly at ea……

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Comprehensive review semiconductor equipment in one article

Updated: 2024-03-22
Views: 6288

Due to the complexity of semiconductor manufacturing processes, different equipment is required for various steps. From a process classification perspective, semiconductor equipment can be mainly divided into silicon wafer production process equipment, wafer manufacturing process equipment, packaging process equipment,……

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Five common types of sensors in the field of industrial automation

Updated: 2024-03-22
Views: 7118

In modern industrial production, especially in automated processes, sensors are almost indispensable. Specifically, industrial producers need to use various sensors to monitor and control various parameters in the production process, ensuring that equipment operates normally and any faults can be promptly detected.

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Everything about Flip Chip Technology

Updated: 2024-03-21
Views: 8108

Flip chip technology originated from IBM, which developed the process of creating bumps on chips for flip chip soldering in 1960. The process involved surrounding the bumps with 95Pb5Sn encasing electroplated NiAu bumps. Later, PbSn bumps were used, employing Controlled Collapse Component Connection (C4) technology, in……

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Everything about bipolar junction transistors (BJTs)

Updated: 2024-03-21
Views: 7059

The bipolar junction transistor was invented by a research team at Bell Laboratories in 1947. The first transistor consisted of two metal wires with sharp endpoints making point contact with a germanium substrate. While primitive by today's standards, this first transistor significantly transformed the entire electroni……

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What is a semiconductor?

Updated: 2024-03-20
Views: 6960

In daily life, all objects can be roughly classified by their electrical conductivity into three categories: conductors, semiconductors, and insulators. This is easy to understand; objects either conduct electricity, do not conduct electricity, or conduct a little bit. It is precisely these materials that are ambiguou……

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Explanation of Common Semiconductor Defect Terminology

Updated: 2024-03-14
Views: 7079

Explanation of Common Semiconductor Defect Terminology

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The development of photolithography technology and a brief introduction to photolithography machines

Updated: 2024-03-13
Views: 7119

Photolithography technology, as a precision microfabrication process, involves transferring meticulously designed micro-patterns onto photosensitive materials. At its core, it utilizes photolithography machines to accurately project patterns onto substrates, enabling the precise manufacturing of microstructures.

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What are the characteristics of MOSFET?

Updated: 2024-03-13
Views: 7166

Parasitic Capacitance and Temperature Characteristics of MOSFET

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Introduction to Semiconductor Materials

Updated: 2024-03-12
Views: 6545

Semiconductor materials are at the core of the semiconductor industry, serving as the foundation for manufacturing electronic and computer chips. There is a wi……

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