Electronics Basics

Technical Information for semiconductors and electronics.

Everything about bipolar junction transistors (BJTs)

Updated: 2024-03-21
Views: 10995

The bipolar junction transistor was invented by a research team at Bell Laboratories in 1947. The first transistor consisted of two metal wires with sharp endpoints making point contact with a germanium substrate. While primitive by today's standards, this first transistor significantly transformed the entire electroni……

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What is a semiconductor?

Updated: 2024-03-20
Views: 9624

In daily life, all objects can be roughly classified by their electrical conductivity into three categories: conductors, semiconductors, and insulators. This is easy to understand; objects either conduct electricity, do not conduct electricity, or conduct a little bit. It is precisely these materials that are ambiguou……

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Explanation of Common Semiconductor Defect Terminology

Updated: 2024-03-14
Views: 10600

Explanation of Common Semiconductor Defect Terminology

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The development of photolithography technology and a brief introduction to photolithography machines

Updated: 2024-03-13
Views: 10403

Photolithography technology, as a precision microfabrication process, involves transferring meticulously designed micro-patterns onto photosensitive materials. At its core, it utilizes photolithography machines to accurately project patterns onto substrates, enabling the precise manufacturing of microstructures.

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What are the characteristics of MOSFET?

Updated: 2024-03-13
Views: 9951

Parasitic Capacitance and Temperature Characteristics of MOSFET

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Introduction to Semiconductor Materials

Updated: 2024-03-12
Views: 9055

Semiconductor materials are at the core of the semiconductor industry, serving as the foundation for manufacturing electronic and computer chips. There is a wi……

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The reliability of electronic packaging ｜ The form of packaging defects and failure

Updated: 2024-03-11
Views: 12506

Introduction: Electronic devices are a very complicated system. The defects and failures of the packaging process are also very complicated. Therefore, the research packaging defect and failure need to have a systematic understanding of the packaging process, so as to analyze the causes of defects from multiple angles.……

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Want to replace STM32 with GD32? These details must be known

Updated: 2024-03-11
Views: 14021

GD32 is a single chip microcomputer developed in China. It is said that the developer is from ST Company, and GD32 is also made with STM32 as a template. Therefore, GD32 and STM32 are the same in many places.However, GD32 is a different product after all, and it is impossible to follow STM32 for everything. Some self-d……

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TI second-generation radar chip deep analysis

Updated: 2024-03-11
Views: 14738

Vehicle-mounted radar is one of the core sensors of Advanced Assisted Driving (ADAS) and unmanned driving, and the vehicle-mounted radar chip is the core of vehicle-mounted radar. Nowadays, the highly integrated (MMIC+DSP/MCU) vehicle-level chip provides a key way for miniaturization, high reliability, stability and lo……

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The difference between IGBT discrete and IGBT module

Updated: 2024-03-11
Views: 11026

The difference between the IGBT discrete and the IGBT module IGBT module can be regarded as the functional improvement and upgrade of the IGBT discrete. Their application fields are basically the same. However, due to the integration of various drivers and protection circuits, the installation of the IGBT module is gre……

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Summary of chip encapsulation type-Is it used with you?

Updated: 2024-03-11
Views: 12976

How much do you know about chip packaging? Why should the chip be encapsulated? What are the types of chip packaging? Chip packaging: In simple terms, it is to put the integrated circuit nude (DIE) produced by Foundry on a substrate with a bearing effect, then lead the tube foot, and then fix the packaging into a whole……

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What is the use of baseband and radio frequency?

Updated: 2024-03-11
Views: 11898

Now "end-to-end" is popular. Let's take cell phone call as an example and observe the whole process of signal from cell phone to base station to see what baseband and RF are for.

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