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Technical Information for semiconductors and electronics.
  • Updated: 2023-10-20
  • Views: 7074
The Israeli-Palestinian conflict has escalated. As of October 14, 2023, the Palestinian Ministry of Health reported that this round of conflict has resulted in 1,949 deaths and over 8,600 injuries on the Palestinian side. Israeli sources claimed that over 1,300 people have died on the Israeli side, with at least 3,484 ……
  • Updated: 2023-10-20
  • Views: 6616
The Israeli-Palestinian conflict has escalated. As of October 14, 2023, the Palestinian Ministry of Health reported that this round of conflict has resulted in 1,949 deaths and over 8,600 injuries on the Palestinian side. Israeli sources claimed that over 1,300 people have died on the Israeli side, with at least 3,484 ……
  • Updated: 2023-10-18
  • Views: 6618
Why are leading semiconductor companies like Intel and TSMC, as well as top global investment institutions like Bain Capital, eager to get close to a small company like IMS? The main reason is that the development of advanced processes is becoming increasingly challenging, and the dependency on high-precision semicondu……
  • Updated: 2023-10-18
  • Views: 6258
Why are leading semiconductor companies like Intel and TSMC, as well as top global investment institutions like Bain Capital, eager to get close to a small company like IMS? The main reason is that the development of advanced processes is becoming increasingly challenging, and the dependency on high-precision semicondu……
  • Updated: 2023-10-13
  • Views: 6620
The key idea of steady-state micro-bunching is to introduce laser modulation into the electron storage ring of traditional synchrotron radiation accelerators. Originally, the electron bunching in the storage ring was achieved using "RF cavities" for microwave radio frequency, but this was replaced by a much more comple……
  • Updated: 2023-10-13
  • Views: 7295
From the official news of Tsinghua University in early 2023, it can be seen that the starting point of the Xiong'an SSMB project is to solve the problem of "neck bottlenecks" in chip production with the support of a ministry. It can be seen that the location and building model of the project have been determined, but i……
  • Updated: 2023-10-13
  • Views: 6369
As we all know, the industry later improved the situation by using a 13.5nm EUV light source, hence the name EUV lithography. Why did they directly jump from a 193nm light source to 13.5nm? Shouldn't there have been gradual reductions like 436-365-248-193nm?
  • Updated: 2023-10-13
  • Views: 7004
The chip manufacturing process described above is applicable to both traditional chips (28nm and above) and advanced process chips (14nm and below). Currently used photolithography machines use mainly DUV light sources, with a light source generator producing ArF (argon fluoride) excimer lasers at a wavelength of 193nm……
  • Updated: 2023-10-13
  • Views: 6572
Both EUV and DUV lithography machines are highly advanced machines, with high demands for industrial production volume and speed. If every step requires re-alignment, assuming that the lithography machine can only process one die per minute, it would process only slightly over 1000 dies per day, and the factory would r……
  • Updated: 2023-10-13
  • Views: 6125
Some people who do not understand the process may think that chip manufacturing relies solely on lithography machines. They may mistakenly believe that a factory only needs a central lithography machine where wafers are placed, and the machine uses light
  • Updated: 2023-10-12
  • Views: 6682
Recently, the SSMB-EUV light source technology proposed by Tsinghua University has attracted great public interest. One claim is that China can build accelerators to generate EUV light sources, and different frequencies of light sources can be used for various chip processes such as 28nm, 14nm, 7nm, and 5nm. Instead of……
  • Updated: 2023-10-12
  • Views: 6514
Completing a semiconductor chip involves many steps, and it is important to screen out defective chips through testing. Many tests are conducted during the semiconductor manufacturing process.

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